Strasbaugh 6DS-SP CMP Tool:

The Strasbaugh 6DS-SP wafer polisher is a fully automated, precision tool for CMP polishing of semiconductor wafers. It can planarize wafers from 100mm to 200mm and is ideally suited for materials polishing applications that require repeatability with operational and processing flexibility The wafer polisher features automatic wafer handling and is capable of polishing two wafers on a single platen to maximize wafer throughput capability and quality .

The wafer polisher uses Chemical Mechanical Planarization (CMP) polishing process. This process removes oxide or metal semiconductor materials using polishing slurry to planarize the wafers to achieve flatness, uniformity and planarization on patterned/ device wafers. The wafer polisher provides: fully automated precision polishing, processing flexibility and repeatable results:

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