For OnTrak refurbished equipment: info@entrepix.com Or Call: 602-426-8677 |
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The Lam (OnTrak) DSS200 Post-CMP Double Sided Scrubber (DSS) is designed to clean wafers using options for a variety of chemical processes, including, but not limited to Post-CMP cleaning. The system is composed of seven components which operate together to achieve processing requirements for semiconductor wafer cleaning. The major system components include:
Wet input station for automated wafer loading into the cleaner. Brush station #1 is the first brush stations the wafers enters in the processing cycle. The first scrub process is performed on PVA brushes using DI water and dilute cleaning chemistries. Brush station #2 is the second brush stations the wafers enters in the processing cycle. This scrub process also uses PVA brushes using DI water and dilute cleaning chemistries. The spin station is the third processing station: wafers receive a final rinse, followed by a spin dry in the SRD while a heat lamp assists in the completion of the drying process. This station may also included an optional Megasonic cleaning station and/ or dilute chemical dispense prior to final rinse. Wafers are transported out of the spin stations using an unload handler/ mechanical arm which transfers the clean wafers to the output station. The output station contains a wafer indexer that receives the wafers from the transfer arm and load the clean dry wafers into a cassette for transfer to the next processing step.
Options:
- Wafer sizes: Configurable for 100 mm, 125 mm, 150 mm, and 200 mm
- Remote Electrical Enclosure
- Megasonic Cleaning Unit
- Edge Cleaning in both brush boxes
- Chemical distribution (Inter- changeable for 2% NH4OH, through the brush, 2% NH4OH drip(standard configurations), NH4OH through-the brush)
- Through-the-back (TTB) Facilities Hook-up
- Through-the-floor (TTF) Facilities Hook-up
- Through-the-Front Wafer Load Input Station
Preventative Maintenance Program |
Upgrades and Refurbishment |
Overview of Service
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Overview of Service |