The SpeedFam Auriga EC wafer polisher is a fully automated, precision tool for Chemical Mechanical Planarization (CMP) polishing of semiconductor (and related industries) 200mm wafers. The Auriga EC is a “dry-in” / “dry-out” process, known for the highest throughput of any CMP tool and is designed for low cost of ownership. The Auriga EC cleaner offers an extended range of pH for cleaning applications, including HF.

Entrepix offers fully refurbished systems, spare parts, upgrades, and maintenance / service support on the Auriga Family of products.

The wafer polisher utilizes CMP, removing virtually any semiconductor materials to polish the wafer and achieve flatness, uniformity, and planarization requirements on blanket or patterned device wafers. The polisher provides: fully automated precision polishing, process flexibility, and repeatable results.