Nitto Denko DR8500-II
Protection Tape Applicator For Back Grind

The DR8500-II is a full-auto type compatible with wafers up to 8”.  They system is equipped with a robot arm for wafer transport, and a CCD-type non-contact aligner for wafer positioning, so wafers are moved with out producing particles.  The system can be easily operated from a touch panel.

Features:
Wafer handling by robot arm
Non contact alignment by CCD sensor
Friendly operation by touch panel
Ionizer Equipped
SECS-1/11 communication function as option

Photo of  Nitto Denko DR8500-II

Specifications:

• Applicable wafer size(Ø):
• (4”), 5”, 6”, 8”
• Applicable ELEP Holder:
• BT-150E Series
• Through-put:
• 75 wafers/hour
• Tape cutting accuracy:
• less than ±0.3mm
• Power supply, Air source:
• AC single-phase 100V 1kW,
• Ordinary use 0.49MPa MIN.
• Dimension (mm):
• W1,020 X D940 XH1,550
• (Line height 900mm)
• Weight: 500kg