Nitto Denko HR8500-II
Protection Tape Applicator For Back Grind
The HR8500-II is a full-auto type compatible with wafers up to 8”. They system is equipped with a robot arm for wafer transport, and a CCD-type non-contact aligner for wafer positioning, so wafers are moved with out producing particles. The system can be easily operated from a touch panel.
Features:
Wafer handling by robot arm
Non contact alignment by CCD sensor
Friendly operation by touch panel
Ionizer Equipped
UV irradiator for protection tape as option
SECS-I/II communication function as option |
Photo of Nitto Denko HR8500-II 
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Specifications:
- Applicable wafer size(Ø):
(4”), 5”, 6”, 8”
- Applicable ELEP Holder:
BT-150E Series, BT-315 Series
- Through-put:
80 wafers/hour
- Power supply, Air source:
AC single-phase 100V 1kW, Ordinary use 0.49MPa MIN.
- Dimension(mm):
W1,020 X D940 XH1,550
(Line height 900mm)
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