The Rudolph FE IV Focus Ellipsometer is designed to provide precision film thickness measurements with simplicity of use.  The systems long-life HeNe laser provides high signal to noise ratio for repeatability and the wavelength accuracy of an atomic transition. Using the same first principle measurement technique used by NIST to calibrate thickness reference standards, Rudolph Technology’s FE IV provides accurate and repeatable results on applications throughout the fab.

The FE IV-D’s advanced Focused Beam™ system uses dual wavelength technology to directly measure the sample with a small spot at multiple angles of incidence and at multiple wavelengths. This allows the system to define more variables, increasing the certainty of the results on complex multi-layer films. The FE IV provides fast reliable data across a wide range of applications. Typical applications include measuring sub 30 Angstrom gates, thick polyimide, ILD on ARC, or small-spot multi-parameter processes.

Focus FE IV Series Features:

• A mature, advanced – technology metrology system
• Inherent accuracy for easy system matching
• Available dual wavelength for absolute order resolution
• High throughput wafer transport for up to 50 wafers per hour
• Robust pattern recognition
• Queued loading for simultaneous measurement, set-up and data review
• Fast, accurate flat/notch wafer aligner
• Powerful, intuitive, easy to use software
• GEM/ SECS II compliant software

Specifications:
System: The Rudolph FE III series is a focused beam ellipsometer for simultaneous multi-angle measurements. In addition, multi-wavelength measurement capabilities are available using the optional second light source on the Rudolph FE III-D.

Light Source:
632.8 nm HeNe Laser, 780 nm laser diode (optional second light source)
Spot Size:
12X24 um test site: de-skew only 125 um, site by site 50 um
Pattern Recognition:
Optional pattern recognition, edge or gray scale detection, manual or auto de-skew, re-teach
Wafer Handling:
3-axis robot with random access to three cassettes for 100 mm, 150 mm, and 200 mm wafers
Pre-aligner:
Virtual flat/ notch finder, x, y, centering +/-50 um, theta +/-0.1 deg., de-skew +/-5 um
Stage:
Accuracy: 7um over 200 mm, repeatability: +/-1 um
Uptime:
>95%; MTBF: >1500 hours