1995 - Qty ≤ 2 |
CMOS |
OXIDE |
TUNGSTEN |
2001 - Qty ≤ 5 |
CMOS |
OXIDE |
TUNGSTEN |
Cu (Ta BARRIER) |
SHALLOW TRENCH |
POLYSILICON |
2011 - Qty ≥ 40 |
||
CMOS |
NEW APPS |
SUBSTRATE/EPI |
OXIDE |
MEMS |
GaAs & AIGaAs |
TUNGSTEN |
NANODEVICES |
POLY-AIN & GaN |
Cu (Ta BARRIER) |
DIRECT WAFER BOND |
InP & InGaP |
SHALLOW TRENCH |
NOBLE METALS |
CdTe & HgCdTe |
POLYSILICON |
THROUGH Si VIAS |
Ge & SiGe |
LOW k |
3D PACKAGING |
SIC |
CAPPED ULTRA LOW k |
ULTRA THIN WAFERS |
DIAMOND & DLC |
METAL GATES |
NiFe & NiFeCo |
Si & SOI |
GATE INSULATORS |
AI & STAINLESS |
LITHIUM NIOBATE |
HIGH k DIELECTRICS |
DETECTOR ARRAYS |
QUARTZ & GLASS |
Ir & Pt ELECTRODES |
POLYMERS |
TITANIUM |
NOVEL BARRIER METALS |
MAGNETICS |
SAPPHIRE |
INTEGRATED OPTICS |
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