June 20, 2011

NCCAVS on 3D packaging: Bring on the TSVs

ElectroIQ

Feature Story

November 15, 2010

Araca and Entrepix Partner to Offer Enhanced CMP Research &
Development Capabilities

Agreement Leverages Entrepix' Established Sales and Marketing Organization to Strengthen Araca's Global Sales Channels

TUCSON, Ariz. - November 15, 2010 - Araca, Inc., a leading provider of analyticalproducts and services for chemical mechanical planarization (CMP) research and development, today announced that it has entered into a Master Services Agreement with Entrepix, Inc., a global provider of CMP equipment and process services for semiconductors and advanced materials. Targeting CMP consumables suppliers, commercial device manufacturers, and academic research and development (R&D) organizations, the agreement enables customers to leverage the combined strengths of both companies with in-depth analysis and fundamental research for virtually any aspect of CMP on any material.

Entrepix Press Release

July 17, 2010

CMP moves from CMOS to new apps in TSV, LED

ElectroIQ

Podcast with Rob Rhoades

July 12, 2010

Smooth Success

Chemical & Engineering News

Cover Story

March 16, 2010

Entrepix Announces Formation of Entrepix Asia; Provides Key Local Equipment Resources to Service China Market

SHANGHAI, China - March 16, 2010 - Entrepix, Inc. (www.entrepix.com, a leading provider of chemical mechanical polishing (CMP) and related equipment and services for semiconductors and other advanced materials, today announced that it has formally established Entrepix Asia Pte. Ltd. Headquartered in Singapore, Entrepix Asia has personnel based in both Singapore and China, including engineering, sales and administrative staff. The new organization will provide direct sales and service support to Entrepix' customers throughout the Asia Pacific region, as well as offer regionally based spare parts inventory for enhanced customer support.

Entrepix Press Release

January 2010

Executive Viewpoints: The recovery has arrived!

Solid State Technology

Editorial