The ABC's of CMP for DWB and SOI
Aug 9, 2010

Presented at the CAMP Conference

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Teaching Old CMP Equipment A Few New Tricks
April 28, 2010

Presented at the CMPUG Spring Meeting

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Pt Vias for High Temperature MEMS Interconnects
June 7, 2010

Presented at IITC

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Balancing Technical and Business Challenges in CMP R & D
Aug 10, 2009

Presented at CAMP Conference (Lake Placid, NY)

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CMP for Direct Wafer Bonding of Hermetically Sealed Cavity Structures
May 25, 2009

Presented to ECS Spring Meeting - Symposium E2

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New Applications for CMP: Solving the Technical and Business Challenges
May 5, 2009

Presented to NSTI Conference (Houston, TX)

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Keeping your CMP Slurry from Being a Pain in the As-Probed Die Yield
Feb 10, 2009

Presented to Levitronix Conference

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Chemical Mechanical Planarization Historical Review and Future
May 19, 2008

Presented to ECS Technology Conference

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CMP Process Development Techniques for New Materials
May 19, 2008

Presented to ECS 213th Meeting (Phoenix, AZ)

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Emerging CMP Applications
CMP-MIC 2008
March 6, 2008

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Accelerating Development Timeframes through Effective Use of CMP Outsourcing
Oct 25, 2007

Presented to ICPT (Dresden, Germany)

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Developing Products for CMP Requires a Module-Level Approach
August 2007

Presented to CAMP Conference

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Semiconductor Industry Trends and What They Mean to CMP
July 17, 2007

Presented to NCCAVS CMP User's Group at Semicon West 2007

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Polysilicon CMP
Mar 5, 2007

Presented to CMP-MIC

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Evolution of CMP for New Applications and Materials
Oct 31, 2006

Presented to ECS Symposium Technology

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Developing CMP for New Materials and New Integration Schemes
Oct 12, 2006

Presented to International Conference on Planarization Technology

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New Applications of CMP for Non-Traditional Semiconductor Manufacturing
Sept 13, 2006

Presented to Semicon Taiwan

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Oxide CMP Process Development with the PPG Fast Pad on the Mirra Platform
Aug 16, 2006

Presented to CAMP Conference 2006

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Process Characterization of CMP Consumables
Jun 01, 2005

Presented to NCCAVS CMP Users Group

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Outsourced CMP for Accelerated Process Development
Mar 01, 2005

Presented to Semi-ECS Technical Symposium
Shanghai, China

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Development of a New Tungsten Pad Utilizing Outsource CMP Capabilities
Feb 01, 2005

Presented to CMP-MIC 2005

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Leveraging Outsourced CMP Foundry Capabilities for Process-level Development through Full Production
Oct 13, 2004

Presented to NCCAVS CMP Users Group

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Advanced Tungsten CMP with No Pad Conditioning
May 05, 2004

Presentation to the NCCAVS CMP Users Group

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Rapid Low-Cost Development of a Planarized 3-Level Interconnect Module
Feb 01, 2004

Presented at CMP-MIC 2004

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Pad Conditioning Optimization and Impact on the CMP Process
Aug 01, 2003

Presented to the CAMP Conference

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