Bruker Tribolab CMP Process and Material Characterization System

Bruker Tribolab CMP Process and Material Characterization System

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The Bruker Tribolab CMP Process and Material Characterization System is an R&D-scale specialty CMP system, offering polishing process control for process development and materials testing. The Bruker Tribolab was designed from the ground up specifically for reliable, flexible and cost-effective characterization of wafer polishing processes.


CMP process development for new materials and CMP consumables (pads, slurries and conditioning disks) research is expensive to perform on full-scale production CMP systems. The combined cost of test wafers, consumables, overhead, depreciation and lost productivity when running tests instead of production wafers has driven a need for a table-top system for R&D.


The Bruker Tribolab provides the flexibility, control and repeatability to perform studies on coupons cut from larger wafers, resulting in substantial savings. The Tribolab offers higher speeds, more torque and better force measurement for CMP applications than any of its predecessors or competitors. 


Benefits:

  • Reproduces full-scale wafer polishing process conditions
  • Provides unmatched measurement repeatability and detail
  • Performs tests on small coupons rather than whole wafers for substantial cost savings

System Specifications:

Measurement Capability
Small footprint, chemical mechanical polishing test platform

    System Attributes
  • Integrated high-speed/high-torque upper and lower rotational drive motors;
  • Servo-controlled precision loading stage; Motorized positioning “lateral” stage;
  • Load/friction sensor for polishing and pad conditioning load control, measurement and recording;
  • In situ acoustic emission and temperature measurement and recording;
  • Corrosion protection of machined parts;
  • Programmable two-pump slurry and rinse pumping system

    Software
  • Bruker Tribolab operating and data analysis software

    Computer System
  • Windows 7, 32-bit OS, 2GB SDRAM, >250GB HDD

    Vertical Position System
  • 100mm (4 in) max travel;
  • 0.5µm (19.7µin) encoder resolution;
  • 0.001 to 10mm/sec (0.04 to 394 min/sec) speed

    Lateral Positioning and Sliding System
  • 75mm (3 in) max. travel;
  • 0.25µm (9.8µin) encoder resolution;
  • 0.001 to 10mm/sec (0.04 to 394 mil/sec) speed

    Wafer Head
  • 1 to 500 rpm speed range;
  • 0.29 to 29 psi range on 2 in wafer head;
  • 0.07 to 7.2 psi range on 4 in wafer head;
  • 4 to 400 N (0.9 to 90 psi) load range for other wafer sizes up to 4 in;
  • 20mN (0.004 lb) resolution

    Platen
  • 1 to 500 rpm speed range;
  • Up to 9 in (228 mm) platen size

    Conditioner
  • 2 to 200 N (0.45 to 45 lb) load range;
  • 10mN (0.002 lb) resolution;
  • Up to 4.25 in conditioning head size

    Torque Capability
  • 5Nm (3.7 ft-lb) @ 100 RPM, 2.5Nm (1.8 ft-lb) @ 500 RPM

    Temperature Measurement
  • -25°C to 1000°C (-13°F to 1,832°F)

    Acoustic Emission Response
  • 0.2 to 5.0 MHz frequency response

    Programmable Pump (optional)
  • 2.2 to 480 mL/min (0.13 to 29 in³/min) flow rate

    Power Requirement
  • 220 VAC, 2.5 kW

    System Dimensions
  • 394mm (W) x 610mm (D) x 775mm (H) [15.5 in x 24 in x 30.5 in]