NexGen MG Series Single-Wafer Wet Etch Platform

NexGen MG Series Single-Wafer Wet Etch Platform

Entrepix provides North America sales and service for NexGen’s MG Series platforms


For NexGen single-wafer wet etch equipment: 
info@entrepix.com


For NexGen spare parts: parts@entrepix.com


For NexGen MG Series equipment service or maintenance: 
service@entrepix.com

Or Call:
+65 9655-2254 (Sales)



NexGen MG Series Single-Wafer Wet Etch Platform

The NexGen MG Series is a proven single-wafer wet etch platform offering customized solutions to address a wide range of customer etch requirements. The company’s patented wet etch technology enables a variety of process applications and technologies, including ultra-thin wafer processing, wafer thickness and TTV control, and the ability to dispense up to four chemistries on a single platform.


NexGen MG Series delivers best-in-class processes and cost-of-ownership performance, with excellent RAM data. Starting with an economic base tool model, the modular platform has a variety of optional add-on modules and technologies available to meet your manufacturing requirements.


The NexGen MG Series comprises:

  • MG2x series: 100 to 200mm processing
  • MG3x series: 100 to 300mm processing
  • Up to 4 different chemistry applications
  • Integrated multicomponent chemistry mix system


The platform achieves best-in-class process performance for:

  • Point-of-use process control
  • Wafer and layer thickness control
  • Ultra-thin wafer processing
  • Concentration control and monitoring

Application

Silicon Substrate Etching

Subgroup

Silicon Substrate Thinning
Stress Relief after Back Grind
Polish Finish Etch
Smooth Finish Etch

Film Removal (wafer front or backside)

Oxide (SiO2) Removal
Polysilicon Removal
Nitride (SiN) Removal
Aluminum/Titanium/Silver/Metal Stacked Film Removal

Film Removal (wafer front or backside)

Oxide (SiO2) Removal
Polysilicon Removal
Nitride (SiN) Removal
Aluminum/Titanium/Silver/Metal Stacked Film Removal

Wafer Backside, Bevel & Wraparound Etch Clean

In conjunction with above Film Removal
Copper/Cobalt decontaminate Removal

Resist Strip Removal without Backside Contamination

SPM

Post-Dry Etch Polymer/Residue Removal for Trench, Vias, Metal Lines and Pad

Proprietary Solvent (e.g., ACT, EKC, ST, NE families)
NMP, IPA, TMAH
DSP, DSP+

Particles Removal Cleaning

SC1, SC2, DHF
DIO3 (Ozone), DHF, Dilute HCl Repetitions
High-Pressure Kinetic Clean

MEMS & Piezoelectric

Surface Acoustic Wave Device Critical Etch
KOH, TMAH Anisotropic Etch
TSV/High-Aspect-Ratio Clean
Thick, Fragile Bonded Wafer Etch/Clean

III-V (13-15) and Compound Semiconductor Related

SiGe, GaN, SiC etch/clean
GaAs, LiNbO3 and Other Compound Specialty Applications

Wafer Maker Related

SOI, SOS applications
Wafer Edge, Bevel & Precise Wraparound Etch/Clean
Wafer Spin Etch Planarization
Selective SiGe Etch