AMAT Refurbished CMP Equipment

AMAT Mirra Reflexion LK CMP System

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AMAT Mirra Reflexion LK CMP System

The Applied Reflexion LK CMP system provides production-proven, high performance planarization solutions for copper damascene, shallow trench isolation (STI), oxide, polysilicon, and tungsten applications. Its high-speed planarizing platens and multi-zone polishing heads enable superior uniformity and efficiency with low downforce for extendibility to < 45 nm device generations.

The integrated post-CMP Desica cleaner uses unique full-immersion Marangoni vapor drying technology to virtually eliminate watermark defects and dramatically reduce particle contamination. The Applied Reflexion LK CMP system also implements a full suite of endpoint methods, in-line metrology and advanced process control capabilities that ensure excellent within-wafer and wafer-to-wafer process control and repeatability for all planarization applications.

Preventative Maintenance Program

Overview of Service

  • General Clean and Inspections
  • Clean and Lubricate All Rails and Drives
  • Baseline Equipment
  • Load Calibrations
  • Platen Run Out
  • Arm Sweep Calibrations
  • Carrier Run Out
  • Down Force Calibration
  • Back Pressure Calibrations
  • Pad Conditioner Operations Check
  • Unload Calibrations
  • Tool-Specific Issues Addressed