AMAT Refurbished CMP Equipment

Applied AMAT Mirra Reflexion CMP System

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For AMAT equipment service / maintenance:

Or Call:
602-426-8677 (Sales)

AMAT Mirra Reflexion CMP System

The Applied Reflexion CMP system is an automated system that uses a combination of chemistry and abrasion under controlled conditions to remove specific amounts of material from wafer surfaces. The Reflexion delivers industry-leading 300 mm CMP on all polishing applications. The system can accommodate up to three load ports, attaching a recipe and automatically performing a sequence to each wafer. The system's Contour polishing head optimizes uniformity across the wafer with five independent pressure zones to deliver unmatched within-wafer uniformity and edge control.

Preventative Maintenance Program

Overview of Service

  • General Clean and Inspections
  • Clean and Lubricate All Rails and Drives
  • Baseline Equipment
  • Load Calibrations
  • Platen Run Out
  • Arm Sweep Calibrations
  • Carrier Run Out
  • Down Force Calibration
  • Back Pressure Calibrations
  • Pad Conditioner Operations Check
  • Unload Calibrations
  • Tool-Specific Issues Addressed