NexGen MG Series Single-Wafer Wet Etch Platform
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Entrepix provides North America sales and service for NexGen’s MG Series platforms For NexGen single-wafer wet etch equipment: For NexGen spare parts: parts@entrepix.com For NexGen MG Series equipment service or maintenance: |
NexGen MG Series Single-Wafer Wet Etch PlatformThe NexGen MG Series is a proven single-wafer wet etch platform offering customized solutions to address a wide range of customer etch requirements. The company’s patented wet etch technology enables a variety of process applications and technologies, including ultra-thin wafer processing, wafer thickness and TTV control, and the ability to dispense up to four chemistries on a single platform. NexGen MG Series delivers best-in-class processes and cost-of-ownership performance, with excellent RAM data. Starting with an economic base tool model, the modular platform has a variety of optional add-on modules and technologies available to meet your manufacturing requirements. The NexGen MG Series comprises:
The platform achieves best-in-class process performance for:
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ApplicationSilicon Substrate Etching |
SubgroupSilicon Substrate ThinningStress Relief after Back Grind Polish Finish Etch Smooth Finish Etch |
Film Removal (wafer front or backside) |
Oxide (SiO2) Removal Polysilicon Removal Nitride (SiN) Removal Aluminum/Titanium/Silver/Metal Stacked Film Removal |
Film Removal (wafer front or backside) |
Oxide (SiO2) Removal Polysilicon Removal Nitride (SiN) Removal Aluminum/Titanium/Silver/Metal Stacked Film Removal |
Wafer Backside, Bevel & Wraparound Etch Clean |
In conjunction with above Film Removal Copper/Cobalt decontaminate Removal |
Resist Strip Removal without Backside Contamination |
SPM |
Post-Dry Etch Polymer/Residue Removal for Trench, Vias, Metal Lines and Pad |
Proprietary Solvent (e.g., ACT, EKC, ST, NE families) NMP, IPA, TMAH DSP, DSP+ |
Particles Removal Cleaning |
SC1, SC2, DHF DIO3 (Ozone), DHF, Dilute HCl Repetitions High-Pressure Kinetic Clean |
MEMS & Piezoelectric |
Surface Acoustic Wave Device Critical Etch KOH, TMAH Anisotropic Etch TSV/High-Aspect-Ratio Clean Thick, Fragile Bonded Wafer Etch/Clean |
III-V (13-15) and Compound Semiconductor Related |
SiGe, GaN, SiC etch/clean GaAs, LiNbO3 and Other Compound Specialty Applications |
Wafer Maker Related |
SOI, SOS applications Wafer Edge, Bevel & Precise Wraparound Etch/Clean Wafer Spin Etch Planarization Selective SiGe Etch |