CMP Process Development & Services

Accelerate Your CMP Process with the Entrepix CMP Foundry

Entrepix provides CMP process services, CMP process development, CMP consulting, process optimization, consumable evaluation and outsourced CMP processing for semiconductor and advanced-material applications.

Our experienced applications team combines extensive CMP process knowledge with dedicated development equipment, advanced wafer cleaning and metrology capabilities to help customers solve challenging planarization problems, shorten development cycles and reduce risk.

From determining initial CMP feasibility to developing and validating a complete process of record (POR), Entrepix provides the expertise and infrastructure needed to move your process forward

How can the Entrepix CMP Foundry help?

Every CMP challenge is different. Materials, device structures, consumables, equipment, cleaning requirements and performance targets all influence the final process.

Entrepix works collaboratively with customers to develop new CMP processes, optimize existing processes and evaluate potential solutions. Our extensive process experience and dedicated R&D environment allow experimentation and process iteration without tying up valuable customer production equipment.

CMP Process Services Built Around Your Application

CMP Process Development

Develop and validate CMP processes for challenging materials, device structures and emerging applications.

CMP Process Optimization

Improve removal rate, uniformity, defectivity, surface quality, cleaning performance and overall process stability.

CMP Consulting

Access experienced CMP applications support for process troubleshooting, technical review and optimization.

Consumable & Hardware Evaluation

Conduct controlled, head-to-head evaluations of slurries, pads, post-CMP cleaning chemistries, hardware and other process variables.

Feasibility Testing & POR Development

Determine whether new materials and structures can successfully withstand CMP processing, then develop and validate an optimized process of record.

Outsourced CMP Production

Access qualified CMP processing for development programs, startups, pilot production or applications where internal capacity is constrained.

From CMP Challenge to Process of Record

A Structured Path to CMP Process Development

Successful CMP process development requires more than identifying a polishing recipe. Entrepix evaluates the interaction between the substrate or device, tool configuration, consumables, chemistry, cleaning processes and performance requirements to develop a solution around your specific application.

1
Step One

Define Requirements

Materials
Device Structure
Integration Constraints
Performance Targets

→
2
Step Two

Develop

CMP Equipment
Slurry & Pad
Chemistry
Process Parameters

→
3
Step Three

Validate

Removal & Uniformity
Defectivity
Surface Quality
Post-CMP Clean & Metrology

→
4
Step Four

Scale

Process of Record
Qualification
Process Transfer
Production / iFlow

CMP Applications & Materials

Extensive CMP Process & Materials Experience

Entrepix has developed CMP expertise across traditional semiconductor processes as well as emerging applications, compound semiconductors and advanced substrate materials. This broad knowledge base can reduce the amount of initial discovery required when developing a new process.

Process Experience

Traditional CMP

  • Oxide
  • Tungsten
  • Copper
  • Barrier Metals
  • STI
  • Polysilicon
  • Low-k Dielectrics
  • Ultra-Low-k Dielectrics
  • Metal Gates
  • High-k Dielectrics
  • Aluminum
  • Analog & RF
  • ILD
  • TSV
Emerging Technologies

Advanced & Emerging Applications

  • Advanced Packaging for AI
  • Photonics & Waveguides
  • MEMS
  • µLED
  • Quantum Computing
  • Direct Wafer Bonding
  • Ultra-Thin Wafers
  • Power Devices
  • Detector Arrays
  • LED & Optics
  • Novel / More-than-Moore Devices
Material Expertise

Advanced Substrates & Materials

  • Silicon & SOI
  • InP & InGaP
  • GaAs & AlGaAs
  • GaN
  • SiC
  • SiGe
  • Sapphire
  • Diamond & DLC
  • Lithium Niobate / Tantalate
  • Quartz & Glass
  • AlN on Silicon
  • GaN on Silicon

CMP Foundry Capabilities

Develop Using Production-Relevant CMP Infrastructure

Developing a successful CMP process requires the ability to polish, clean, characterize and iterate. The Entrepix CMP Foundry combines CMP equipment, post-CMP cleaning and metrology capabilities in a dedicated development environment.

CMP Equipment

Production-Relevant CMP Platforms

AMAT Mirra
IPEC 472

CMP equipment supporting process development, optimization, testing and qualification.

Wafer Cleaning

Post-CMP Cleaning

OnTrak DSS-200

Advanced post-CMP wafer cleaning capability for integrated CMP and cleaning process development.

Development Environment

Dedicated CMP Foundry

Class 100 / ISO 5

Dedicated cleanroom environment for CMP process development, consumable evaluation and testing.

Metrology

Measure & Validate Results

Film & Substrate Thickness TTV Measurement Long-Scan Profilometry AFM Surface Analysis Microscopy & SEM Surface Particle Analysis

Accelerate Your Path to POR

50+ YEARS
CMP & Clean Experience

EXTENSIVE CMP PROCESS PORTFOLIO
Start from existing knowledge, not zero

DEDICATED R&D FACILITY
Develop without consuming production capacity

ZERO CMP CAPITAL INVESTMENT
Access equipment, expertise and metrology as needed

iFab™ Integrated & Distributed Process Services

When Your Process Doesn't Stop at CMP

Many semiconductor and advanced-material development programs require multiple specialized process steps beyond CMP and post-CMP cleaning. Coordinating those capabilities across different suppliers can add time, complexity and risk to the development process.

iFab™ extends Entrepix CMP Process Services beyond the Foundry by connecting core CMP, wafer cleaning and metrology capabilities with complementary semiconductor process resources. Customers can engage Entrepix for a single process step or for broader coordination of a distributed process flow.

The result is a more integrated approach to process development, allowing your team to focus on the application while Entrepix helps coordinate the processing required to move from concept toward a qualified process.

iFab™
Distributed Process Services
Coordinating specialized semiconductor fabrication capabilities around your development needs
ENTREPIX CORE
CMP + POST-CMP CLEANING
Test & Device
Wafer Acquisition
Wafer Coating &
Edge Rounding
Wafer Laser Scribe
Film Deposition
Metallization
Metrology &
Analysis
Temporary & Direct
Wafer Bonding
Wafer Thinning, Lapping
& Backgrinding
Wafer Dicing

Ready to Solve Your Next CMP Challenge Faster?

Whether you’re developing a process for a new material, optimizing an existing CMP process, evaluating consumables or preparing to scale, Entrepix provides the expertise, equipment and process-development resources to help you get there faster and with less risk.

Let’s turn your CMP challenge into a production-ready process.