Entrepix has appointed India Handotai as our representative in India, expanding local access to our CMP, wafer cleaning, process development, equipment upgrade, and engineering solutions.

We're excited to support India's rapidly growing semiconductor ecosystem with local expertise and world-class wafer processing solutions.

Entrepix, Inc., a global expert in CMP and wafer cleaning and a subsidiary of Amtech Systems, Inc., announced a new representative agreement with CWI Technical Sales to expand sales of its DSS-200 Ontrak wafer cleaning system—along with Entrepix CMP parts, services, and upgrades—across the Eastern United States and Eastern Canada. CWI will focus on accelerating adoption of the fully modernized DSS-200 double-sided wafer cleaning platform, which features an updated control system, optimized handling for thin or fragile substrates, and configurable support for odd wafer sizes suited to novel substrate production.

Entrepix has entered into a representative's agreement with  Legatech, appointing them as the exclusive sales representatives for the United Kingdom and Nordic region for all products including CMP replacement parts and upgrades and wafer cleaning systems, parts and upgrades.  

Entrepix, Inc. is pleased to announce today that it has entered into a representative's agreement with Eumetrys, appointing them as the exclusive sales representatives in France for all products including CMP replacement parts and upgrades and wafer cleaning systems, parts and upgrades.

Entrepix is pleased to introduce its latest product, the LK Prime pad conditioner gimbal flexure. Designed to reduce downtime of Applied Materials Reflexion LK Prime CMP systems, this enhanced conditioner gimbal flexure reduces breakage through optimized geometry and superior materials of construction. The benefits delivered by this upgraded LK Prime pad conditioner gimbal flexure start with reduced cost and extend into multiple dimensions of reliability including reduced downtime, and reduced wafer scrap caused by unexpected failure.  

The choice of wafer carrier backing films for rigid back-plate wafer carriers can significantly influence the quality and yield of the final semiconductor product. With the discontinuation of the Pureon DF200 films we evaluated three possible replacement products and compared results across multiple factors including mean removal rate, mean induced range, mean WIWNU% as well as WTWRR%.